Applications > Semiconductor > Wafer Level Packaging
Wafer Level Packaging (WLP)
As semiconductor device manufacturers attempt to further shrink the size and increase the reliability of packaged devices, plasma is increasingly used for advanced applications during wafer level packaging.
Typical applications include incoming wafer cleaning; organic and inorganic contamination removal; etching of thin film layers including silicon nitride, silicon oxide, and benzocylcobutene (BCB); removal of wafer-applied mold or encapsulation material; photoresist etching and descum; wafer surface cleaning and roughening; and surface activation to improve bondability, increase wettability, and improve uniformity of liquid flow over the wafer surface.
March’s plasma systems for WLP applications are designed to provide highly repeatable results with excellent etch rates and uniformity (both within wafer and wafer-to-wafer). Our systems are also capable of handling multiple wafer sizes (including 6, 8 and 12 inch wafers) and are capable of high-throughput automated processing.
Options include SECS/GEM factory automation software. Our WLP plasma systems are also configurable to meet your demanding production requirements.
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Semiconductor Applications Team
Scott D. Szymanski, Global Marketing Manager
Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A. from the University of Phoenix.
Jack Zhao, Senior Applications Scientist
Dr. Zhao joined March in 2001. He is responsible for application process development, R&D and key account support. Prior to March Dr. Zhao has held positions in the university system and semiconductor industry. Dr. Zhao holds a Ph.D. in Chemical Engineering from the University of Missouri-Columbia and has been working in the plasma application field for more than 10 years.
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The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>
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