Applications > Semiconductor > Wafer Level > Wafer Cleaning
Wafer Cleaning
Plasma cleaning has traditionally been applied to removal contamination generated during a process in the device fabrication at the wafer level, or generated during an upstream assembly process. In either case, cleaning the product to remove contamination such a fluorine, oxides or metals significantly enhances the yield, reliability and performance of the integrated circuit.
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Related Products:
FlexTRAK™ Plasma Treatment System
The FlexTRAK system offers high-throughput capability of up to 480 substrates or process carriers per hour. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.
FlexTRAK-WR™ Plasma Treatment System
The FlexTRAK-WR plasma treatment system is designed for
high-throughput processing of semiconductor wafers up to
300mm
(12 in.).
Semiconductor Applications Team
Scott Szymanski, Semiconductor Market Manager
Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A. from the University of Phoenix.
Peter Huang, Semiconductor Applications Engineer
Mr. Huang joined March Plasma Systems in 2006. Prior to his appointment at March he has held a variety of positions in L3 Communications, Raytheon and Texas Instruments. Huang has a BS from Chung Yuan University in Taiwan and a MS from the University of Houston.
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