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Leading Plasma Innovations

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors.

Applications > Semiconductor > Wafer Level > Wafer Cleaning

Wafer Cleaning

Plasma cleaning has traditionally been applied to removal contamination generated during a process in the device fabrication at the wafer level, or generated during an upstream assembly process. In either case, cleaning the product to remove contamination such a fluorine, oxides or metals significantly enhances the yield, reliability and performance of the integrated circuit.

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Related Products:

FlexTRAK™ Plasma Treatment System

FlexTRAK™ Plasma Treatment System

The FlexTRAK system offers high-throughput capability of up to 480 substrates or process carriers per hour. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its unique slim structure minimizes floor space requirements.

FlexTRAK-WR Plasm Treatment System

FlexTRAK-WR™ Plasma Treatment System

The FlexTRAK-WR plasma treatment system is designed for
high-throughput processing of semiconductor wafers up to
300mm (12 in.).

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Semiconductor Applications Team

Scott Szymanski

Scott Szymanski, Semiconductor Market Manager

Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A. from the University of Phoenix.

 

Peter Huang

Peter Huang, Semiconductor Applications Engineer

Mr. Huang joined March Plasma Systems in 2006. Prior to his appointment at March he has held a variety of positions in L3 Communications, Raytheon and Texas Instruments. Huang has a BS from Chung Yuan University in Taiwan and a MS from the University of Houston.

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Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
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Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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