Applications > Semiconductor > Encapsulation and Mold
Encapsulation and Mold
Organic-based substrates, like those used in BGA packages, and metal leadframes are susceptible to delamination. Delamination is caused by poor adhesion of the encapsulant compound to the multiple interfaces on the substrate package including solder mask, the die top passivation, and the substrate metallization. Peel tests and C-mode scanning acoustic microscopy (C-SAM) have proven that delamination issues are significantly reduced when packages are plasma treated prior to molding. Plasma processing greatly improves adhesion of mold compounds by increasing the substrate surface energy and results in increased package reliability.
The figure below displays the effect of plasma on adhesion of mold compound to differing solder mask formulations. In general with increasing plasma exposure the adhesion level increases.
The figures below display the adhesion enhancement with plasma. Note that the failure mode for the plasma treated sample results in cohesive failure of the substrate as opposed to adhesive failure in the non-treated substrate.
Without plasma treatment
With plasma treatment
Plasma treatment is also used for other microelectronic applications including wafer cleaning prior to wafer dice, surface activation prior to package marking, improvement in solder wetting, and to enhance the conformal coating process. In conformal coating applications the encapsulating resin may not completely wet the substrate surface resulting in coating voids and delamination. Plasma ensures that the fluid completely wets the numerous materials on the PCB and enhances the coating adhesion.
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Semiconductor Applications Team
Scott Szymanski, Semiconductor Market Manager
Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market. With 10+ years of experience at major semiconductor companies, he holds a B.S. degree in Mechanical Engineering from UCLA, and an M.B.A. from the University of Phoenix.
Peter Huang, Semiconductor Applications Engineer
Mr. Huang joined March Plasma Systems in 2006. Prior to his appointment at March he has held a variety of positions in L3 Communications, Raytheon and Texas Instruments. Huang has a BS from Chung Yuan University in Taiwan and a MS from the University of Houston.
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