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AP-1000 Plasma Treatment System - Reliable operation in the most demanding production environments

The plasma chamber is constructed of 11-gauge stainless steel with aluminum fixtures for superior durability. The chamber has multiple removable and adjustable shelves to accommodate a range of part carriers including magazines, trays, wafer and Auer boats.

Products > Semiconductor > AP-1000 Plasma Treatment System

AP-1000 Plasma Treatment System

AP-1000 Plasma System

 

The March AP-1000 is designed to meet the rigorous demands of 24-hour operation in high-performance manufacturing environments. The system delivers quality plasma treatment along with unmatched reliability, safety and ease of operation and maintenance.

All the components of the system, including the plasma process chamber, the control electronics, the 13.56 MHz power supply with automatic impedance matching network, and the pumping system are housed within an enclosure constructed of rugged powder coated aluminum.

Optional AP-1000 HTP for enhanced productivity The AP-1000 plasma system with HTP (high throughput) shelves combines the reliability and process quality of the AP- 1000 system with the proven benefits of March’s proprietary shelf design.

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PDFAP-1000 Data Sheet

 

Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
More>>>

Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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