Products > Semiconductor > Anisotropic RIE Plasma System
CS-1701 Anisotropic RIE Plasma System
The March CS 1701 Reactive Ion Etching system delivers performance often associated with high- investment etching tools. The system is excellent for metal etching, silicide etching and etching of III-V compounds, anisotropic etching of nitrides, oxides and polyimides.
Key performance features of the CS 1701 system include the large DC bias and the ability to control process pressure independent of gas flow. The system allows users a wide variety of etch profiles ranging from anisotropic requiring high aspect ratios to sloped walls.
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Semiconductor
The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>
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