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The FlexTRAK™ system offers short cycle times that quadruple throughput over other available systems.

The March TRAK series of gas plasma equipment provides unparalleled treatment uniformity and process consistency.

Products > Semiconductor > FlexTRAK Plasma Treatment System

FlexTRAK™ Plasma Treatment System

FlexTRAK™ Plasma Treatmnet System

 

The FlexTRAK™ plasma treatment system is the latest addition to the March TRAK series, and is a highly configurable, high-throughput plasma system. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors. Its small chamber volume and proprietary process control enable unmatched short cycle times, while its slim structure minimizes floor space requirements.

HIGH-THROUGHPUT PROCESSING CAPABILITY
The FlexTRAK system handles a wide variety of product form factors, including boats, carriers, Jedec/Auer® boats, strips, laminates and wafers. Depending on throughput and product form requirements, the system can be configured for magazine- to-magazine processing of single and multiple strips or lead frames, reel-to-reel, wafer processing, and standalone for island-based production environments.

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PDFFlexTRAK™ Data Sheet

 

Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
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Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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