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World Wide Laboratories

High reliability and high yield of advanced packages can be difficult to achieve as size decreases and use of advanced materials increases. We maintain an expert staff of scientists and engineers trained in plasma science for advanced packaging, medical device and PCB technologies.

Applications > Laboratory

Our Laboratories

Our development laboratories are equipped and staffed to provide process support that meets your specific application requirements. We are happy to demonstrate how plasma can improve your process yields and product reliability by running samples for you, free of charge. All samples are run under general clean room conditions, and our labs are equipped with contact angle, micro-section, weight loss, surface energy, and stereoscope testing capabilities.

World Wide Laboratory Locations:

Corporate Overview

USA Facilities
Main application, R&D labs
and our contract services
location in CA, FL.

Research and Development

Europe
Lab facilities located in Maastricht, The Netherlands.


China Lab Facilities

Mainland China 
New lab and office facilities located in Pudong, Shanghai  China.

Media Center

Singapore
Offices and Lab facilities in the Asia Pacific region of Singapore.

  

 

Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
More>>>

Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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