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 News > Press / Reduce Voiding in Eutectic Die Attach/ January 2002    
 

March Partners with Palomar Technology GmbH to Reduce Voiding in Eutectic Die Attach

 

Concord, CA - March Plasma Systems has partnered with Palomar, a leading manufacturer of equipment used to produce optoelectronic and semiconductor devices, to optimize processes that minimize voiding in eutectic die attach.

"We are excited about the opportunity to establish solutions for these manufacturing challenges with a company such as Palomar, a leading automated assembly equipment supplier," says James Getty, Business Development Manager, March Plasma Systems.

Plasma treatment increases surface energy for improved yields in wire bonding, component attach, encapsulation and underfill. Plasma removes contaminates and oxidation, and is the preferred method for materials treatment.

March offers a full range of plasma systems from batch to in-line systems. Batch systems have flexible shelf configurations to accommodate process carriers, magazines and circuit boards. In-line systems can support single or multiple carriers per run, and are SMEMA-compatible with the option of SECS/GEM host integration.

March Plasma Systems, a subsidiary of Nordson Corporation, is the leader in the manufacture of gas plasma treatment systems. A complete view of March Plasma System products can be found on the Internet at www.marchplasma.com.

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For further information contact:


March Plasma Systems (International Headquarters)

James Getty
March Plasma Systems, Inc.
4057 Port Chicago Highway
Concord, CA, USA 94520-1122

TEL: 925 827 1240
FAX: 925 827 1189

E-mail: info@marchplasma.com
Web: http://www.marchplasma.com


 



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