Concord, CA - March Plasma Systems has developed a two-step plasma process that effectively modifies Teflon® surfaces and desmears resin at the same time. Teflon® activation increases the surface energy of Teflon®, providing excellent lamination and wettability for plating through-holes. Desmear removes smeared resin from the barrels of inner layer posts to ensure an electrical connection after plating. Chemical processes do not have the flexibility to treat Teflon® surfaces and other resins mixed in the same panel.

Teflon®-based materials are commonly used in circuit boards for microwave applications in the telecommunications, military and aerospace industries. Due to their hydrophobic properties, it is difficult to deposit electroless copper on Teflon® surfaces or to apply direct metalization without first changing the surface energy. Use of radio-frequency, low-pressure plasma is an efficient, cost effective, and environmentally friendly method of surface activation and removing drill smear.

March scientists have developed plasma processes for pure Teflon® material and filled Teflon® material (fillers include random glass micro-fiber, woven glass reinforced, and ceramic PTFE composites) that replace liquid chemical processes with low cost plasma processes.

March Plasma Systems is the leader in gas plasma technology for micro- and opto-electronic packaging, PCB, and webbed material industries. Batch systems are available in several chamber sizes with multiple-shelf configurations to accommodate magazines, strips, circuit boards, wafer and process carriers. In-line systems can support multiple substrates or carriers per run, and are SMEMA-compatible.