The XTRAK gas plasma treatment system provides a fast,
efficient method for surface treatment and cleaning prior
to wire bonding, die attach, encapsulation, conformal
coating and other processes. Plasma processing enhances
lamination bond strength, improves wire bond strength
and uniformity, promotes underfill adhesion and enhances
die attach.
March
Plasma Systems is the leader in gas plasma technology
for PCB, micro- and opto-electronic packaging, and webbed
material industries. Batch systems are available in several
chamber sizes with multiple-shelf configurations to accommodate
magazines, strips, circuit boards, wafer and process carriers.
In-line systems can support multiple substrates or carriers
per run, and are SMEMA-compatible. A complete review of
March's plasma treatment systems may be found on the Web
site at www.marchplasma.com.