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Press / Plasma System For Uniform, High-Reliability Plasma Processing / February 2004

 
 

PCB 2800 SYSTEM FOR UNIFORM, HIGH-RELIABILITY PLASMA PROCESSING

 

Concord, CA - The PCB 2800 plasma treatment system provides unparalleled process uniformity for Teflon™ activation, desmear and etchback in high-volume circuit board applications. Low cost of ownership is realized with compact system configuration and upgraded features for quick pump-down. In addition, low gas consumption ensures long-term favorable economics.
Our latest design includes:

  • Increased process uniformity:
    The PCB 2800 system is configured with 14 cells, each cell holding two 457 x 610 mm (18 x 24 in.) PCB panels vertically. The consolidation of electrodes from two sets to one result in improved power distribution for more efficient and uniform plasma throughout the chamber.

    Electrode alignment bars keep the electrodes equally spaced from cell to cell and within a cell. Equally spaced cells ensure uniform plasma for treating both sides of the panel simultaneously, unlike other systems that require flipping. Non-conductive alignment guides ensure that panels are held parallel and centered within the cell, further increasing uniformity.

    All aspects of the plasma process - pressure, power, time, temperature, and gas flow - can be configured independently to achieve unprecedented treatment uniformity.

  • Ultimate process flexibility:
    The PCB 2800 plasma system is configured for either rigid or flex materials, or both. Switching between material types is easy; rack and cart assemblies are quickly exchanged with minimal downtime.

  • Improved ergonomics:
    The system redesign eliminated one of the front doors, reducing footprint dimensions and simplifying PCB panel loading and unloading. Two rear doors allow easy access for efficient serviceability.

March Plasma Systems is the leader in gas plasma technology for micro- and opto-electronic packaging, PCB, and webbed material industries. Batch systems are available in several chamber sizes with multiple-shelf configurations to accommodate magazines, strips, circuit boards, wafer and process carriers. In-line systems can support multiple substrates or carriers per run, and are SMEMA-compatible.

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For further information contact:


March Plasma Systems (International Headquarters)

Vicki Worth
March Plasma Systems, Inc.
2470-A Bates Avenue
Concord, CA USA 94520-1122

TEL: 760 930 3324

E-mail: info@marchplasma.com
Web: http://www.marchplasma.com


 



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