March Plasma Systems And Microbonds Form Technical Alliance
Concord , CA, June, 2006 – March Plasma Systems, Inc. a Nordson Corporation company (NASDAQ: NDSN) and Microbonds Inc. (a private Canadian corporation) today announced a co-development project to align the technology roadmaps of Microbonds' insulated wire bonding technology, X-WireT Technology, with the March Plasma Systems line of automated and batch plasma treatment systems.
Microbonds' X-Wire Technology enables bonding wires connecting the die to the substrate to touch without causing an electrical short, facilitating the adoption of fine diameter bonding wires, longer bonding wires, area array bonding, higher density stacked die, multi-tier and other 3-D packages, as well as an array of new packaging designs.
March Plasma Systems is the global leader in plasma processing technology for the Semiconductor industry, specifically wafer level and advanced packaging applications. The company designs and manufactures advanced plasma treatment systems, and maintains an expert staff of scientists and engineers trained in plasma science for advanced packaging technology.
"Microbonds' X-Wire Technology is an innovative solution to some of the pressing interconnect packaging and yield challenges facing many of our customers, and we are eager to support the evolution of a robust and cost effective insulated bonding wire solution", said Peter Bierhuis, President of March Plasma Systems.
"Plasma treatment is commonly used in the packaging process to improve bond strength and increase device yield and reliability. Ensuring compatibility of our insulating technology with all aspects of the assembly process is a key component in our commercialization efforts " stated John Scott, CEO of Microbonds Inc. "The expert technical capabilities of the March Plasma Systems team has been instrumental in helping us develop compatible process windows that will meet the requirements of our common customers" he continued.
March Plasma Systems is the global leader in plasma processing technology for the semiconductor, microelectronics, printed circuit board (PCB), medical devices, and life sciences industries. March has operations and support centers worldwide, including California, Florida, Europe, Singapore, China, Japan, Korea and Taiwan. With over 20 years of continuous innovation, March designs and manufactures a complete line of award-winning and patented plasma processing systems. An expert staff of scientists and engineers is available to assist in the design of plasma processes that improve both product reliability and increase production yields.
March Plasma Systems, Inc. is a wholly owned subsidiary of Nordson Corporation, (Nasdaq: NDSN) the world's leading producer of precision dispensing equipment.
About Microbonds:
Microbonds, Inc. is the leading developer and licensor of insulated wire bonding
technologies for use in the design and assembly of microelectronic devices. The
company's X-WireT Technology has recently received a Technology Innovation Award
from SEMI®.
For more information, see www.microbonds.com
For further information contact:
March Plasma Systems – World Headquarters
Scott Szymanski
March Plasma Systems, Inc.
2470-A Bates Avenue
Concord, CA 94520-1122
TEL: 925.246.1666
sszymanski@marchplasma.com
Microbonds
John M Scott
151 Amber St Unit 12
Markham ON L3R 3B3
TEL: 905-305-0980 x222
Semiconductor
The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>
Medical Device
The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media. More>>>
Printed Circuit Board
Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>