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Leading Plasma Innovations

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors.

Applications > Crosslinking

Crosslinking

The process of plasma induced crosslinking involves a physical or chemical reaction that breaks chemical bonds on the surface of the material. The resulting radicals in the polymer chain react with adjoining chains linking one polymer chain to another which improves the surface’s barrier and biocompatibility characteristics. It is also a means to remove weakly bonded species from the surface of materials. Some surfaces can be effectively sealed with this process. Sealing reduces the potential for gases or liquids to penetrate into the surface and/or it also prevents internal mobile species from migrating to the surface or blooming.

 

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Semiconductor

Semiconductor Advanced Packaging

The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>

Medical Device

Life Sciences

The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
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Printed Circuit Board

PCB

Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>

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