Products > Semiconductor >XTRAK Plasma Treatment System
XTRAK Plasma Treatment System
Unique to the industry, the XTRAK can be configured in the downstream ion-free mode - removing ions, electrons and photons, enabling the chemically active radicals and byproducts to perform the work using oxygen as the source gas. The patentpending XTRAK-IFP system is ideal for cleaning pre-programmed memory devices when UV exposure may be an issue. Multiple plasma modes allow unrestricted choice of any process gas.
SMART TUNE™ MANAGEMENT SYSTEM
The XTRAK’s SMART Tune management system provides
closed-loop plasma control that optimizes the RF system and
minimizes tuning time. The system automatically recycles to a
plasma-ready state, compensating for changes in vacuum
pressure, temperature and varied lot sizes. Maximum power
to the chamber is achieved with a proprietary algorithm that
constantly measures forward and reflective power inside the
chamber.
The system operates in both automatic and manual modes, with a multi-processing feature that allows implementation of single or multiple recipes in one operation. By integrating the XTRAK system with loaders, the XTRAK operates in a standalone configuration. It can also run in an island formfactor to feed a designated line of equipment, including component attach systems, wire bonders and dispense equipment.
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XTRAK Data Sheet
Semiconductor
The Semiconductor Business Group focuses on plasma processes for advanced semiconductor packaging and assembly (ASPA), wafer level packaging (WLP), microelectromechanical systems (MEMS), data storage devices such as thin film read-write heads (TFH) for hard disk drives, and images sensors. More>>>
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The Medical Device Business Group is engaged in providing enhanced product performance, more reliable devices and lower cost processes to companies who manufacture leading edge medical devices including cardiac rhythm management products, catheters, stents, ocular devices, and filter media.
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Printed circuit board manufacturers work with our PCB Business Group due to the implementation of new materials technology, and smaller geometries in HDI, flex, and rigid flex applications. More>>>